Comparison of Thermal Conductivity Between Microporous Nano Plate and Fiber Board
The thermal conductivity of microporous wire method at RT to 1000℃ temperature range, and the nano plate and fiber board was measured by non steady hot- results were analyzed and explained by SEM micro morpholo- gy analysis and fluorescence spectrum composition analysis, combined with micro thermal conductivity mechanism.The results show that the thermal conductivity of the nano plate is in the range of 0.03 to 0.1W/(m·K), and the fiber board is 0.055 to 0.25W/(m-K) ,the thermal conductivity of the two materials both have an upward trend with in- creasing temperature, the difference is that the thermal conductivity of fiber board began to increase sharply after 300℃, while the nano plate started after 550℃ .However, the overall trend of the nano plate was obviously slower than that of the fiber board,and the higher the temperature, the greater the difference.Analysis suggests that the nano-sized particles and internal pores are the key factors that lead to low thermal conductivity of nano plates
-
Calcined Bauxite welding grade block material
-
Calcined Bauxite high voltage porcelain grade
-
expanded perlite 2-4mm for horticulture
-
super grade clacined Flint Clay
-
Fire clay insulation fire brick high strength
-
Aluminate Refractory Cement CA50
-
WFA Al2O3 99%min white fused alumina refractory grade
-
Zirconium grade Ceramic fiber board HZ